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BTZ-3000 AUTO PROBE DEVICE

 

Name

BTZ-3000 AUTO PROBE DEVICE

片台X轴行程

Stroke of wafer-stage in X direction

110mm

片台Y轴行程

Stroke of wafer-stage in Y direction

110mm

测试范围

Test range

110mm×110mm

片台Z轴高度行程Max

Stroke in hight of wager-stage in Z direction

6mm

测试芯片最大尺寸

Maximum dimension of test chip

4英尺(根据客户要求改成6英寸片台,测试行程不变)

4inches

承片台转角

Angel of the wafer-stage

±30°

外形尺寸

repeat precision

580×440×260mm不包含显微镜高度

Not includingthe hight of the microscope

重量

Weight

24kg

打点器电源

Power

24V

显微镜

microscope

 Binocular stereomicroscope

放大倍数

magnification times

4100

 

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